From 11-13th March, the embedded systems industry will meet for the 23rd time at the Exhibition Centre Nuremberg to see the latest developments in embedded systems live. In seven exhibition halls, exhibitors will provide insights into the entire product range – from hardware, services and tools to software. “During embedded world, all relevant key players, industry experts, and industry associations from the embedded systems sector come together. This not only offers a unique opportunity for networking, but also the chance to experience brand new technologies on site,” says Executive Director Benedikt Weyerer. Visitors can find out about exhibitors' products and services in the exhibitor’s forum and refresh their knowledge of embedded technologies in the expert panels. I hope you enjoy the March issue of Electronic Specifier and stay tuned on the website for the latest news from embedded world.
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MARCH 2025 Volume 14, Issue 03
visit US: Hall 3A, 424 win 1 of 3 dev kits daily
embedded world 2025
Insights into the world of embedded systems
NEWS
ROBOTICS
AWARDS
WOMEN IN TECH
Learn what's on show at embedded world
Join us and #women4ew for a special WiT event
Advancing humanoid robots
Electronics Excellence Awards shortlist
PREPARING THE ENGINEERS OF THE FUTURE Learn more: https://uk.farnell.com/tektronix-academic-campaign
CONTENTS.
Show preview/ See the latest developments in embedded systems Show news/ Learn about what’s on show at embedded world 2025 Women in Tech/ Electronic Specifier and #women4ew partner EW: IIoT/ DigiKey and Würth Elektronik – simplifying IIoT
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EW: RedCap/ 5G for the IoT at a third of the cost
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EW: Robotics/ Advancing humanoid robotics with Single Pair Ethernet EW: Medical/ The role of Edge computing in medical IoT devices
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EW: FPGAs/ FPGAs powering AI in medical devices
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EW: Open source/ Will the next valuable electronics companies be open source?
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Security: Cyber/ The Cyber Resilience Act
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T&M: FPGA/ Automatic board test made by FPGA Electronics Excellence Awards/ The shortlist is announced
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Managing Editor: Paige West paige.west@electronicspecifier.com Associate Sales Director: Ben Price ben.price@electronicspecifier.com Sales Associate: James Anstee james.anstee@electronicspecifier.com
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Copyright 2025 Electronic Specifier. Contents of Electronic Specifier, its publication, websites and newsletters are the property of the publisher. The publisher and the sponsors of this magazine are not responsible for the results of any actions or omissions taken on the basis of information in this publication. In particular, no liability can be accepted in result of any claim based on or in relation to material provided for inclusion. Electronic Specifier is a controlled circulation journal.
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SHOW PREVIEW
From 11-13th March, the embedded systems industry will meet for the 23rd time at the Exhibition Centre Nuremberg to see the latest developments in embedded systems live. See the latest developments in embedded systems
I n seven exhibition halls, exhibitors will provide insights into the entire product range – from hardware, services and tools to software. “During embedded world, all relevant key players, industry experts, and industry associations from the embedded systems sector come together. This not only offers a unique opportunity for networking, but also the chance to experience brand new technologies on site,” says Executive Director Benedikt Weyerer. Visitors can find out about exhibitors' products and services in the exhibitor’s forum and refresh their knowledge of embedded technologies in the expert panels. embedded world Conference The programme of the embedded world Conference, which takes place on all three days of the trade fair, offers more than 200 hours of exchange and knowledge. Prof. Dr. Axel Sikora, Chairman of the Conference, gives an initial insight into the programme: “This year we received well over 600 submissions for the embedded world Conference – this is an all-time high! And
the programme committee and steering board were also subjectively impressed by the high and ever-increasing innovative strength of the industry.” According to Chairman Sikora, the 2025 conference will once again focus on a wide range of topics. Embedded intelligence, i.e. the use of AI in embedded applications, as well as the challenges and solutions for ‘Systems of Systems’, i.e. networked complex, so-called ‘dependable’ systems, are particularly important. electronic displays Conference The electronic displays Conference will take place on the 12th and 13th March in NCC Ost parallel to the embedded world Exhibition & Conference. “Submissions for the electronic displays Conference have almost reached the previous year's high. They are characterised by a high level of expertise and innovation and address all important areas of professional displays. The highlights in Nuremberg will certainly be MicroLED displays, which are seen as the ‘next big thing’,” says Prof Dr Karlheinz Blankenbach,
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SHOW PREVIEW
Chairman of the electronic displays Conference.
a dedicated space for women in embedded systems to connect, learn, and support one another. The event will be host to insightful keynotes, and the opportunity to take part in a Q&A with industry experts, followed by a networking session where the conversations and connections can carry on. Paige West, Managing Editor at Electronic Specifier will be moderating the event and comments: “We’re thrilled to be partnering with #women4ew at embedded world for this fantastic speaking and networking event. At Electronic Specifier, we believe in supporting initiatives that foster diversity and inclusion in the electronics industry. Events like this provide an essential platform for women to connect, share insights, and inspire the next generation of engineers and leaders. We look forward to being part of these important conversations
The keynote sessions on the topics of ‘Markets & Trends’ and ‘Advanced Displays’ are particularly noteworthy. As last year, the keynote sessions will be followed by the ‘Author Interviews’. These will allow participants to engage in in-depth discussions with the speakers. #women4ew networking event Electronic Specifier is pleased to announce its partnership with embedded world's #women4ew conference, taking place on 13th March. The event will be hosted and moderated by Electronic Specifier’s Managing Editor, Paige West, and is proudly sponsored by DigiKey, Analog Devices, and Renesas.
Now in its third year, women4ew provides
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Widest selection of electronic components ™ In stock and ready to ship
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and celebrating the incredible talent in our industry.” embedded award 2025 The embedded award honours outstanding innovations at the embedded world Exhibition & Conference. The seven-member expert jury sifted through around 130 submissions for this year's competition. The award will be presented in nine specialist disciplines during a networking event on the first day of the trade fair. “It was not only the large number of submissions, with which the exhibitors once again set a record, but also the high quality that made our jury's heads spin. But it is fascinating to see how innovations are being successfully driven forward in all disciplines of the embedded systems world. It is particularly pleasing that the new Electronic Displays category was immediately very well received. A sign that we have taken the right step by including the ninth category,” emphasises jury chairman Prof. Axel Sikora. The community choice award was launched last year, and the winner has a very special honour because, as the name suggests, this
award involves the embedded community. In contrast to the specialist disciplines – where the jury of experts determines the winner – every trade fair participant can vote for their favourite of the 27 nominated products in the community choice award. Voting for the community choice award is still possible until 11th March 2025, 4pm. Visit Electronic Specifier We invite attendees (3A-424) to connect with the team during the event for networking opportunities and to discuss the latest industry trends. We will be showcasing the embedded world edition of Electronic Specifier Design Magazine. Copies of Procurement Pro, our newest title, will also be available. Visitors will also have the opportunity to enter a prize draw to win some Bose noise-cancelling headphones. We would also like to invite industry professionals, thought leaders, and innovators to join us for the prestigious Electronics Excellence Awards ceremony, where we will unveil the winners across multiple categories. The ceremony will take place on the 12th March at the embedded world Hall 3 forum at 4.30pm.
View floor plan
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EXHIBITOR LISTING
Exhibitor list
4A-360
3A-418
3A-125
3A-111
4-504
4A-342
1-401
5-314
3-431
3-241
5-154
4A-633
4-468
3A-125
3A-424
3A-528
4A-312
3-610
3-517
1-340
3-628
5-282
3A-424
4A-138
3A-303
3-329
4-528
2-100
1-340
3A-135
2-453
4A-102
4A-646
1-643
4A-310
1-211
4A-222 & 3A-128
3A-532
1-304
4-539
4A-260
4A-103
3A-424
4-578
5-161 & 5-144
3-318
4-427
3A-422
4-218
2-248
1-320
4A-148
1-510 & 3-153
3-419
3A-131 & 3- 619
1-223
4-149
4A-635
5-253
3A-625
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Arrow Electronics' advanced embedded technologies Arrow Electronics will showcase its latest embedded technology solutions at embedded world 2025. Arrow will exhibit at booth 4A-342, a 410-square-meter space showcasing cutting-edge technologies for embedded designs. successful realisation of differentiated embedded solutions. Visitors will explore how these efforts drive digital transformation and pioneering new business models. Visitors to the Arrow booth will gain insights into the technologies driving
how Arrow enables faster and more efficient embedded design processes.
Visit Arrow Electronics: 4A-342
Arrow’s presence at embedded world will demonstrate its approach to enabling innovative embedded system designs. Through collaboration with many leading suppliers and customers, Arrow supports demand creation, rapid design cycles, and the
the future of embedded systems, including practical solutions for designing secure, AI-powered, and highly automated systems. embedded world 2025 offers an opportunity to engage with industry experts, explore the latest innovations, and discover
Embedded technology applied in innovative ways
Dacom West, a value-added distributor from Germany, will be showcasing a retro game at embedded world 2025, located at its booth in Hall 5. This exciting demo will highlight the capabilities of advanced embedded systems through the nostalgic lens of classic gaming. Visitors will have the opportunity to experience firsthand how embedded technology can be applied in innovative ways, blending retro charm with modern solutions.
In addition to the immersive demo, Dacom West is offering a chance to win a prize, adding an extra layer of excitement for attendees. Whether you’re a gaming enthusiast or an industry professional, this unique opportunity provides a fun way to explore the potential of embedded systems. Make sure to stop by the booth at embedded world 2025 for a thrilling experience and your chance to win a special prize! Don't miss out on this exciting blend of technology
and nostalgia!
Visit Dacom West: 5-154
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SHOW NEWS
IQRF at embedded world 2025
automation. With over two decades of expertise, IQRF has redefined how devices communicate within large- scale, self-healing wireless networks, providing manufacturers and integrators with seamless, scalable solutions. Get an exclusive first look at new IQRF transceivers, designed for enhanced performance and extended range, ensuring robust communication even in high- interference RF environments. Live
demos will highlight scalable mesh management, advanced diagnostics, and real-world applications. Experience firsthand how IQRF True Low Power® technology minimises energy consumption, making battery- powered IoT applications significantly more efficient and sustainable. IQRF® is available as an open standard, allowing everyone to implement its technical advancements under a single royalty-free license.
At embedded world 2025, IQRF® will showcase its latest advancements in wireless mesh technology, delivering unparalleled reliability, security, and efficiency for Industrial IoT, smart cities, and
Visit IQRF: 3-628
Rohde & Schwarz ready T&M solutions
Rohde & Schwarz will present its advanced test and measurement solutions for the embedded industry at the embedded world Exhibition & Conference. The company will showcase its ever- growing range of next-generation oscilloscopes with the R&SMXO 4, R&SMXO 5 and the rackmount- optimised R&SMXO 5C series.
Visit Rohde & Schwarz: 4-218
Visitors can also experience the R&S ScopeStudio, a new solution that brings the functionality of the MXO to a PC, making visualising, analysing, and sharing oscilloscope measurements easier. In combination with matching high quality active and passive probes, the exceptionally fast MXO oscilloscopes help design engineers enhance the reliability of their power electronics and other embedded systems.
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Analog Devices at embedded world 2025
Analog Devices will be connecting with industry leaders in Nuremberg for embedded world 2025. Visitors to the ADI booth will have the opportunity to explore 18 feature- rich demos which highlight the company’s broad portfolio and their ability to deliver system- level solutions that enable their customers to stand out in the market. Among the innovations on show, ADI’s software capabilities will be demonstrated across a range of functionality in its CodeFusion Studio platform. By visiting the ADI booth,
attendees will learn more about ADI’s commitment to advancing the performance, and accelerating the development of embedded system design. Whether through direct customer support, design tools, or robust technical resources, ADI is focused on providing exactly what customers need to bring their systems to life. ADI will demo the powerful capabilities of Red Pitaya’s STEMlab platform, enhanced by ADI's high- performance converter technology. This all-in-one signal processing
platform supports rapid prototyping, precise data acquisition, and efficient debugging within a compact, multifunctional tool.
Visit Analog Devices: 4A-360
New long-life DDR4 DRAM components and modules
chips to be used per module due to their smaller data width per check. This creates fully JEDEC-compliant, high-density DDR4 DRAM modules with capacities of 64, 128, or even 256GB. As x4 components are more complex and expensive to produce, most memory manufacturers keep them for their own memory. Intelligent Memory is one of the few memory manufacturers that offers both, DRAM components and DRAM modules in addition to NAND flash memory products, and thus has also launched two new enterprise- grade DDR4 memory modules with a x4 organisation for operating temperatures ranging from -40 to +95°C: the IM 32 DDR4 VLP RDIMM in 1 rank, and the IM 64GB DDR4
RDIMM in 2 ranks.
Applications like automotive, AI/ ML, big data analytics, and HPC need massive memory bandwidth and low error rates. Standard memory configurations cannot handle such issues effectively. Intelligent Memory ensures data integrity and reduces the likelihood of undetected errors by enabling advanced error-correcting technologies. This combined with its improved bandwidth and scalability, makes the IM DDR4 x4 components ideal for applications where data integrity is vital, like in financial transactions, healthcare systems, and even Cloud computing where a 99.999% uptime is key.
At embedded world 2025, Intelligent Memory showcases its high-density DDR4 components with a x4 output in 16 and 32Gb capacities and speeds of up to 1600MHz in commercial and industrial temperature ranges. As Intelligent Memory focuses on providing memory and storage technologies for embedded, industrial, and specialty applications, the new components are qualified for extended temperatures of -40 to 95°C. These new components are ideal for DRAM modules as they allow more
Visit Intelligent Memory: 1-340
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The power of buying from an authorised source Authenticity and reliability are essential in managing end-of-life (EOL) semiconductor components. As manufacturers phase out older products, businesses must establish a secure and trustworthy supply chain to avoid risks like counterfeit- ing and component failure. Rochester Electronics, an AS6496-compliant supplier, provides a continuous, authorised supply of EOL and active semiconductors, helping businesses maintain stability, safety, and long-term success.
safely prepare for EOL.
Companies that are not prepared become vulnerable to counterfeits, as well as quality and reliability issues. Even for those companies who proactively prepare, long-term component storage remains a problem. Buying from an authorised source that partners with the OCM eliminates these risks. Fully authorised distributors, like Rochester Electronics, are compliant with the SAE Aerospace Standard, AS6496. Simply stated, they are authorised by the OCM to provide traceable and guaranteed products with no quality or reliability testing required because the parts are sourced from the OCM. Those providers who are not, market themselves as AS6171/4 compliant. This source, though better than no compliance, follows standardised inspections and test procedures with minimum training and certification requirements to detect suspicious or counterfeit components. This is an indication the parts are not sourced to the supplier from the OCM but have passed testing to minimise, not eliminate risk. The only way to eliminate these risks is to purchase from a fully authorised source like Rochester Electronics, who is AS6496 compliant.
Critical end-of-life component management Product lifecycles typically extend far beyond active semiconductor component availability, making lifecycle status a key factor when planning, at any phase, in the new product introduction (NPI) process. As technology evolves and new semiconductor products increase in demand, the manufacturing volume increases. Naturally, the older products are phased out. This is the EOL phase of the semiconductor lifecycle. When the original component manufacturer (OCM) chooses to discontinue a product, they typically offer an EOL purchase, better known as a ‘last time buy’. Most industries will face component EOL at some point and with it, come a wide range of challenges and risks. In high-reliability industries, semiconductor lifecycle management becomes a critical factor. This practice allows for businesses to
For more information visit: www.rocelec.com
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Electronic Specifier and #women4ew partner for Women in Tech forum
held marketing roles at global semiconductor firms and spent 12 years as editor of a technical magazine. Before joining Blueshift Memory, a semiconductor IP startup, she worked as a marketing consultant and freelance technology writer. A Chartered Engineer, Duncan serves on the UKTIN Semiconductor Experts Working Group and has advised on UK semiconductor and telecoms policy. She is also involved in promoting women in deep tech and has served on the IEEE UKI Women in Engineering Committee. Madaan, a technology leader in IoT, AI, and embedded systems, will also be speaking. At Anders Electronics, UK, she focuses on display solutions, industrial PCs, and embedded systems, recently launching a trademarked product to help engineers develop MVPs in 24 hours. She holds an MBA from De Montfort University, UK, and a background in electronics and communication engineering. An advocate for women in STEM, she has spoken at GHC24 and the Women in Leadership Society and mentors women in tech and startups. Following the keynote talks, a Q&A session moderated by Paige West will provide an opportunity to gain further insights from the speakers. Afterward, a networking event with drinks and nibbles will offer chances to engage with the speakers and fellow attendees. S upporting diversity in tech Electronic Specifier has been actively championing women and diversity in STEM. It launched its first Women in Tech event in 2023, encouraging open discussions and professional connections. The success of this initiative led to the creation of its Women in Tech LinkedIn group. In 2024, Electronic Specifier partnered with Women in Electronics at electronica to host a Women in Tech forum and co-launched the ‘Global Industry Workforce Survey’ to examine challenges women face in the electronics sector.
WOMEN IN TECH
O n 13th March 2025, Electronic Specifier and embedded world's #women4ew are hosting a joint Women in Tech forum and Q&A. The event will be introduced and moderated by Electronic Specifier’s Managing Editor, Paige West, and is proudly sponsored by DigiKey, Analog Devices, and Renesas. embedded world, taking place between 11-13th March 2025 in Nuremberg, Germany, is a key gathering place for experts and suppliers from across the embedded systems industry. Over three days, the event hosts specialist forums and expert panels, covering hardware, systems, distribution, electronic displays, embedded vision, and more. Now in its third year, #women4ew provides a dedicated space for women in embedded systems to connect, learn, and support one another. Keynote speakers Helen Duncan, CEO at Blueshift Memory, and Sakshi Madaan, Product Manager at Anders Electronics, will be speaking at the event. Duncan will discuss ‘Taking the Slow Route to CEO’. Starting as a microwave design engineer, Duncan later
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WOMEN IN TECH
Scan the QR Code to join Electronic Specifier’s Women in Tech Group on LinkedIn and take part in the conversation.
At embedded world 2025, Electronic Specifier continues this commitment by partnering with women4ew. The event will offer insightful keynotes, an expert Q&A, and networking opportunities. Paige West, Managing Editor at Electronic Specifier, said: “We’re thrilled to be partnering with women4ew at embedded world for this fantastic speaking and networking event. At Electronic Specifier, we believe in supporting initiatives that foster diversity and inclusion in the electronics industry. Events like this provide an essential platform for women to connect, share insights, and inspire the next generation of engineers and leaders. We look forward to being part of these important conversations and celebrating the incredible talent in our industry.” Event details: Date: Thursday, 13th March
Time: 1pm – 3pm
The future is intelligent. Let Arrow guide you there.
Location: Start-up area, Hall 2
Agenda: 1.00 – 1.10pm: Welcome talk and introductions 1.10 – 1.25pm: Helen Duncan, CEO, Blueshift Memory – ‘Taking the Slow Route to CEO’ 1.25 – 1.40pm: Sakshi Madaan, Product Manager, Anders Electronics – keynote talk (TBC) 1.40 – 2.00pm: Discussion and Q&A moderated by Paige West
embedded world Nuremberg – March 11-13, 2025 Hall/booth 4A-342
2.00 – 3.00pm: Networking
Scan the QR code to register for your free ticket. Enter voucher code: women4ew25.
arrow.com
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EW: IIOT
DigiKey and Würth Elektronik – simplifying IIoT As the Industrial Internet of Things (IIoT) continues to make waves across various industries, the demand for seamless integration, reliable connectivity, and efficient deployment solutions only continues to grow.
T o address these needs, DigiKey and Würth Elektronik have partnered to offer an extensive range of products and tools designed to simplify IIoT implementation. Focusing on connectivity, development resources, and efficiency, businesses will find the support they need to transform their operations with ease. This article will explore some of the solutions for IoT connectivity and sensors, development and deployment tools, as well as strategies for enhancing IIoT efficiency. Whether it’s enabling Cloud connectivity or retrofitting legacy systems, DigiKey and Würth Elektronik have the building blocks for a connected future. IoT connectivity & sensors Robust connectivity and reliable sensor technology lies at the heart of any IoT ecosystem. DigiKey and Würth Elektronik provide a comprehensive suite of solutions tailored to meet these critical requirements. From Wi-Fi and Bluetooth Low Energy (BLE) modules to advanced RF and multiprotocol modules, this portfolio enables seamless communications across diverse industrial applications.
Würth Elektronik's BLE range, dubbed ‘Bluetooth Smart,’ brings Bluetooth wireless connectivity to small, low-cost, battery devices that require longevity and reliability. This technology is key to enabling a wide range of critical applications such as healthcare sensors, remote controllers, watches, and more. For instance, the Proteus-I Bluetooth Smart 4.2 Module BLE from Würth Elektronik, featuring ultra-low peak, average, and idle power consumption alongside long multi-year battery life, low-costs, multi-vendor interoperability, and enhanced range capabilities. If Wi-Fi connectivity is more essential, then look no further than Würth Elektronik's WLAN module, Calypso, a compact Wi-Fi module based on IEEE 802.11 b/g/n with a fully featured TCP/IP stack. Calypso is readily integrable to any embedded application owing to its Edge castellation, smart antenna configuration, and an easy-to-use AT-style command interface. The module also supports IPv4 and IPv6 whilst also implementing key network applications such as SNTP, DHPv4, DHCPv6, mDNS, HPPT(S), and MQTT off the shelf. Designed with industrial applications in mind, the Calypso Wi-Fi module offers advanced security features like six secure sockets, secure boot, storage, and OTA updates. It additionally suits serial cable replacement and low-power IoT applications with Cloud connectivity. If both Wi-Fi and Bluetooth capabilities are needed than Würth Elektronik's multi-protocol modules are a good option. The WIRL-COMB: Stephano-I Radio Module from Würth Elektronik is a small form radio module designed for
By Rolf Horn, Applications Engineer, DigiKey
Figure 1. Würth Elektronik's Proteus-I Bluetooth Smart 4.2 Module BLE (2608011024000). (Image source: Würth Elektronik)
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Next-gen wireless SoCs are here
START DEVELOPING WITH nRF54L15 DK nordicsemi.com/nRF54L15DK
MEET US AT EMBEDDED WORLD, BOOTH 4A-310
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The Ophelia-III radio module is equipped with extra pins for custom device or sensor connections, making it versatile and ready to be tailored to a user’s project. Complementing these connectivity options are MEMS (Micro-Electromechan- ical System) sensors, designed to deliver precise data acquisition for monitoring and automation. Together, these technologies form the foundation of IIoT systems, empowering businesses to establish connected, data-driven operations with ease and scalability. Würth Elektronik has a wide portfolio of MEMS sensors which you can find on the DigiKey site. Capable of measuring temperature, pressure, acceleration, and more, these MEMS sensors are fully supported by Würth Elektronik’s Software Development Kits (SDKs) and evaluation boards off-the-shelf. Development & deployment tools Developing and deploying IIoT solutions can often be a complex and resource-in-
Figure 2. Würth Elektronik's Calypso Wi-Fi Radio Module (2610011025000). (Image source: Würth Elektronik)
IoT applications which combines Wi-Fi and BLE capabilities into one low-power, smart package. Stephano-I is particularly ideal for embedded systems in need of wireless communication capabilities, easily integrable thanks to operating through a UART interface and controlled via AT commands. While this range of products is great, sometimes a scenario calls for a more tailored approach. In this case, Würth Elektronik also offers firmware customisable solutions such as the Ophelia-III Radio Module. Würth Elektronik’s Ophelia-III modules are designed for wireless communication between devices such as control systems, remote controls, and sensors. Without pre-installed firmware, the Ophelia-III offers engineers the flexibility to integrate proprietary firmware or utilise the Nordic nRF Connect SDK for custom applications like BLE, Zigbee, or Thread. The module includes an integrated PCB antenna and provides the option to connect an external antenna for greater range. Powered by the nRF52840 chip, it combines high performance with low power consumption.
tensive process. Würth Elektronik is streamlining this with a range of
open-source SDKs and evaluation boards via its modular FeatherWing stackable boards. Würth Elektronik’s open-source SDKs, written in C, are fully customisable to suit specific requirements. These SDKs enable seamless integration of a wide range of sensors with IIoT systems, facilitating real-time insights and automated decision- making. Additionally, Cloud connectivity design kits aid in simplifying integration into Cloud-based ecosystems, enabling faster, more efficient IoT deployments. These tools are designed to empower developers to bridge the gap from concept to implementation with ease. Fully compatible with the Feather form factor, Würth Elektronik's FeatherWing development boards are open source and
Figure 3. WIRL-COMB: Stephano-I Radio Module (2617011025000). (Image source: Würth Elektronik)
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We connect and protect
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outcomes with minimal disruption. By doing so, businesses can reduce costs, improve productivity, and maximise the benefits of connected technologies. For instance, if a company had a 15-year-old CNC machine that features proprietary control software and an IoT incompatible control interface, a first reaction might be to replace the machine to keep up with the times – especially if said machine is incapable of being tampered with due to a service contract and causing common issues. However, what if rather than forking out the big bucks for a new machine, the old machine could be retrofitted in a non-invasive way that still allows for the reaping of the benefits of IoT? In this case, a CNC machine can be retrofitted with wireless connectivity to the Cloud utilising the previously explored wireless modules which allow the collection of machine data from the existing control system in the Cloud as well as remote control of the machine. Additionally, the aforementioned range of various sensors can be mounted and connected to improve the quality of range of data collected. This data can be visualised for improvements, understand the status of the machine, or used alongside artificial intelligence/machine learning (AI/ ML) applications to enable predicative maintenance and process optimisation. This approach allows older machines to get even more expected useful lifespan, aid in the digitisation process, reduce the need for outdated training, have a more positive environmental impact, and improved efficiencies. Owing to these factors on top of new machine spendings, businesses can expect a return of investment within the first couple of years via retrofitting. Würth Elektronik’s wide portfolio for retrofitting or new designs can be found on the DigiKey website.
stackable, adding functionality and room for prototyping. The boards cover a wide range of applications including sensors, Wi-Fi, wireless, and power. These boards are also expandable with other FeatherWings from Würth Elektronik or Feather/QWIIC form factor devices. For instance, Würth Elektronik's Sensor FeatherWing can be utilised across its temperature, humidity, acceleration, and absolute pressure sensors, connected over a shared I2C bus. If power application is the focus, then Würth Elektronik's MagI³C power FeatherWing is a good solution. This board features operating input voltages of 9, 12, 15, 18, and 24V, industrial rails and a maximum 36V input voltage with an additional USB connector for 5V input voltage to select by switch. Enhancing efficiency Efficiency lies at the core of successful IoT implementation, whether that be with a newer system or unlocking the potential of legacy ones. Here, retrofitting is key and Würth Elektronik provides the tools required to retrofit older systems and optimise workflows to achieve the best
Figure 4. Ophelia-III Radio Module (2611011022000). (Image source: Würth Elektronik)
Figure 5. WSEN-ITDS 3-Axis Acceleration Sensor (2533020201601). (Image source: Würth Elektronik)
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Figure 6. Würth Elektronik's Sensor FeatherWing (2501000201291). (Image source: Würth Elektronik)
Figure 7. Würth Elektronik's MagI³C power FeatherWing (2601157101001). (Image source: Würth Elektronik)
Conclusion Würth Elektronik offers a comprehensive portfolio of connectivity solutions, development tools, and efficiency-enhanc- ing technologies to empower businesses in tackling the complexities of IIoT with confidence and precision. Whether it’s integrating advanced sensors, deploying modular development boards,
or retrofitting legacy systems for a connected future, their solutions provide a clear pathway to optimising industrial operations. As IIoT continues to evolve, DigiKey and Würth Elektronik remain well-positioned to support businesses in achieving their goals, enabling smarter, more efficient, and sustainable industrial ecosystems.
Visit DigiKey at embedded world: 4A-633
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Everyone wants to use the latest technology. For communications, that means 5G, and even people who have scant understanding of technology and relatively modest demands will want to see the 5G symbol appear on their phone. And they are prepared to pay for it. T hat’s fine for phone users for whom their smart device has become their primary interface with the connected But again, on the other hand, 5G includes a lot of other nice features that LTE did not – low latency, time sensitive networks, point-to-point communications. Many of these capabilities target industrial and IoT applications. Does your IoT application need low-cost mobile broadband that’s here to stay? (RedCap: 5G for the IoT at a third of the cost)
world. If you are handling your finances on your phone, paying in supermarkets, holding video conferences, accessing streaming services, even booking an Uber, you need the fastest access possible. But there are many other applications that require Internet access, but which do not need this high level of performance. One might be tempted to say, 'OK, well there is always 4G/LTE'. But that’s just the point, we know that 4G/ LTE only has a limited life span. The exact timing is not known, but the first 4G LTE sunset announcements could be made as early as 2030. For those looking to introduce industrial automation in smart factories using a connected network of industrial sensors, for example, five or even ten years is not a long time. And yet 5G – which certainly will have longevity – is probably an overkill solution for many IoT applications. If you are not looking to stream video, then you don’t need 5G’s blistering speed which will cope with gigabits per second of throughput in the downlink and uplink. Why pay for capabilities you don’t need and won’t use? There’s also another issue – design complexity. 5G designs are not simple to implement; there are a lot of design considerations and decisions to be made around the silicon, RF modulation, baseband processing and more – essentially issues that become much more challenging at the high speeds that 5G delivers.
It is into this space that the 3GPP (3rd Generation Partnership Project) consortium – the body of seven national or regional telecommunication standards organisations and other stakeholders in the communications ecosystem focused on developing mobile communications protocols – have released a new category of 5G. 5G NR Release 17 introduces ‘RedCap’ (Reduced Capability, also known as NR-Light), which is a platform positioned to applications that do not need the extreme speeds offered by ‘full’ 5G, but which do need a stable connection, fast response time, and the assurance of a long installed life. By decreasing the speed, many of the design complexity challenges are removed, power consumption is significantly reduced leading to increased battery life, device footprint is smaller, and parts can be much more cost effective – coming in at around one third the price of ‘classic’ 5G. RedCap-enabled systems deliver speeds of 220Mbps (downlink) and 100Mbps (uplink). Design optimisations include: • Narrower bandwidths – 20MHz in <7GHz
By Mads Fischer, European Sales Director, SIMCom
• Single transmit and receive antennas
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(option to have two receive antennas)
• Lower transmit power support
• Lower-order modulation – optional 256-QAM
• Optional support for half-duplex FDD
modules adopt the LGA +LCC form factor with various interfaces, measuring 30 x 30 x 2.5mm. The AT commands of SIM8230 modules are compatible with SIMCom’s SIM7600/8200/8260 series 4G/LTE devices which also minimises costs for customers and shortens time to market. SIM8230 modules deliver up to 220Mbps (DL)/100Mbps (UL) for Sub-6G SA, or 200 Mbps (DL)/75Mbps (UL) for LTE. Modules are available in different versions for use in different regions. Due to their high efficiency, security and flexibility, the modules suit various IoT and M2M applications including indoor CPE, MIFI, and industrial control. We expect RedCap technology and our 5G RedCap modules to be ideally suited to low-cost mobile broadband applications, and because they are pin-for-pin compatible with our 4G/LTE modules, designers can
Moreover, 5G radio technology is a move in the right direction for utilising the frequency spectrum – possibly the world’s newest identified ‘natural resource’ – more effectively, so opening up 5G for a much wider range of applications in the IoT space is a very good thing. To support customers looking to implement a RedCap 5G platform and enable them to get up and running quickly and easily, SIMCom is amongst the first to offer a RedCap module. SIMCom is committed to providing a variety of cellular wireless modules and solutions and maintains a 5G laboratory spanning more than 5,000 square metres, staffed by a senior R&D team of nearly 1,000 professionals. SIMCom’s SIM8230 is a multi-band 5G NR/LTE-FDD/LTE-TDD module which supports R17 5G SA. With a rich set of protocols and interfaces including PCIe, USB2.0 and GPIO, the module delivers great flexibility and integration. SIM8230
effectively plug and play with exiting designs that they may have already.
Visit SIMCom at embedded world: 3-223
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Advancing humanoid robotics with Single Pair Ethernet By Diana Lahl, Product Marketing Engineer and Dhane Jones, Robotics Systems Engineer, Texas Instruments Humanoid robots are becoming more complex and precise, with a higher number of degrees of freedom (DOF) and an AI-powered central compute engine, and are now capable of assessing, adapting, and responding to the surrounding environment within milliseconds.
Figure 1. SPE interface
D esigning these advanced humanoid robots requires a communication system that can support high-bandwidth, real-time data transfer across numerous joint controls, all within a space-constrained lightweight framework that remains reliable and robust in noisy industrial environment. TI Single Pair Ethernet (SPE) PHYs address these challenges and simplify system architecture for humanoid’s seamless motion execution. Simpler system architecture and lighter weight with SPE To achieve high update rates and high bandwidth (of up to 1000Mbps) for the joint control, an advanced real-time
control system architecture is required. Ethernet-based systems simplify architecture by providing a single, high-bandwidth communication standard that facilitates data exchange between multiple system components. Further use of SPE (xBASE-T1) technology, as shown in Figure 1, and or daisy-chain topology can reduce the overall size of the wiring harness, playing a crucial role in minimising the robot’s weight – an essential factor in humanoid robots, where lower weight enhances mobility, energy efficiency, and balance. Advancing robotics with Single Pair Ethernet PHYs TI’s portfolio of SPE PHYs is designed to be footprint compatible with both TI’s 100BASE-T1 and 1000BASE-T1 PHYs. Single board design allows for upgrades to the feature set or bandwidth in future developments with no hardware changes. This approach helps to accelerate development cycles and reduce time-to-market, thus saving R&D costs.
Figure 2. Possible time stamping locations
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Figure 3. GPIO event capture with TI PHY
Additionally, TI SPE Ethernet PHYs integrate a suite of advanced features to further reduce humanoid design complexity and enhance system performance. Precise time synchronisation Leveraging precise time synchronisation can enhance a distributed humanoid robot system by enabling seamless and deterministic coordination across joints. TI’s SPE PHYs, a 1000BASE-T1 DP83TG721S-Q1 and a 100BASE-T1 DP83TC817S-Q1, integrate IEEE 802.1AS enabling precise network-wide time synchronisation with single time reference across controller and I/O nodes. This allows developers to offload timestamping from the processor onto the PHY, thereby achieving synchronisation accuracy as low as 1-15ns. Leveraging timestamping in SPE PHYs Ethernet PHYs integrating IEEE 802.1AS can improve real-time decision-making and adaptive behaviours of humanoid subsystems. Timestamping is the process of marking incoming and outgoing data or events with precise time information as data or event are generated or received. Timestamping can be implemented in
several locations on the data path as shown in Figure 2 – in the hardware of the Ethernet PHY, in the hardware of the MAC IP in the processor, or in the processor’s software. TI’s processors and Ethernet PHY portfolio can support all three types of timestamping. The accuracy and jitter of the clock data can vary from milliseconds to nanoseconds depending on the proximity of timestamp to the cable. Timestamping at the Ethernet PHY, the closest component to the cable, increases synchronisation precision by accounting for indeterministic latencies that occur as data passes through the PHY. GPIO event capture or generation Precise GPIO event timing capability further improves synchronisation across multiple motor controllers and is beneficial for tasks requiring detection and response coordination across subsystems. Both DP83TG721S-Q1 and DP83TC817S-Q1 have the capability to create Timestamps and Event Triggers in PHY hardware instead of the controller. The Ethernet PHY not only stores the time of the day with integrated IEEE 802.1AS, but can also use it to capture (Figure 3) or generate (Figure 4) events on its GPIO pins with nanosecond accuracy. Generated events can be in a form of a pattern, such as 25MHz-clock implementation, or in a form of pulses at specific times.
Figure 4. GPIO event generation with TI PHY
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robotics system with limited access to internal components. SPE-based network can minimise downtime to diagnose and troubleshoot network issues and cable faults with Ethernet PHY’s built-in cable diagnostic capabilities, such as signal quality indicator (SQI) and time domain reflectometry (TDR), accessible though serial management interface (SMI). SQI monitors link quality by evaluating signal strength, noise levels, and transmission errors to provide real-time status of connection heath. In a closed system like humanoid robot, SQI can detect signal degradation or instability early to allow for proactive maintenance or identify which part of the network is experiencing problems. SQI value at any given time is stored in a register and can be correlated to a signal-to-noise ratio (SNR) with a simple calculation. Figure 6 shows an example of SQI value increasing with more noise. TDR identifies faults along the cable length, such as shorts or opens, and the distance from the PHY. Figure 7 (Buntz & Daimler AG, 2017) shows different types of faults that can be detected with TDR capability. This diagnostic method can be highly useful to pinpoint exact location of a fault within the cable. As Figure 8 shows, TDR works by injecting high energy pulses into the cable and measuring the reflected signal (in phase, out
Figure 5. Galvanic coupling concept
Robustness and reliability Overcoming EMI and EMC challenges Humanoid robots present a space-con- strained system with multiple electronic components, motors, actuators, and power electronics, all of which can create interference. As such, managing electromagnetic compatibility (EMC) is critical, as electromagnetic interference (EMI) can disrupt sensor readings and control signals within the robot. TI’s 100BASE-T1 and 1000BASE-T1 Ethernet PHYs are designed to meet OPEN Alliance EMI/EMC standards, offering proven robustness from the automotive market that is now essential in robotics. Robust architecture for noise using galvanic isolation, as shown in Figure 5, allows for TI parts to be compliant with industrial IEC and CISPR standards for EMI/EMC. For more details please refer to EMC/EMI Compliant Design for Single Pair Ethernet application note. Cable diagnostics Troubleshooting network issues can prove to be a challenging task in a closed
Figure 6. SQI example
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of phase, or no pulse). TDR test is usually run to find the root-cause when there is no active link between the PHYs. When used in a humanoid, these powerful and effective fault isolation tools improve overall system reliability and uptime. System implementation The Application Specific MCUs (ASM), such as C2000 family and Arm-based MCU portfolio at TI is compatible with several real-time Ethernet communication protocols that can also be leveraged with Standard Ethernet technology. In addition, TI developed SORTE protocol, that can achieve cycle times of 4μs, is compatible with Arm-based MCU family for applications that require higher throughput and implement SPE. For more details, please refer to Simple Open Real-Time Ethernet (SORTE) Device with PRU-ICSS reference design. Designing functional safety capable Ethernet PHYs and working with third parties to certify MCU software stack makes sure functional safety requirements within the robotic system are met. In humanoid robots, SPE is used in either point-to-point or daisy-chain configurations to connect motor controllers that coordinate movement across various subsystems. Frequently, a gateway-based architecture is employed for managing multiple controllers and motor subsystems. With ASM + DP83TC812S-Q1 (100BASE-T1 SPE PHY) evaluation module, TI has demonstrated how a multi-node real-time based system
Figure 7. Possible faults along the cable
can achieve 60ns jitter performance, enabling deterministic and predictable system behavior. Please contact TI for further information about the test setup. Summary SPE technology plays a transformative role in advancing humanoid robotics and paving the way for future scalability by addressing critical design challenges such as high bandwidth real-time communication, precise time synchronisation and EMI/EMC noise robustness in a constrained space. By integrating features like IEEE 802.1AS and GPIO event trigger, Single Pair Ethernet enables most accurate system reaction and response. Building on these capabilities, TI’s portfolio of highly integrated MCUs is optimized to work seamlessly with TI Ethernet PHY drivers, providing compatibility and streamlining system development to meet high performance needs of a modern-day humanoid. Visit Texas Instruments at embedded world: 3A-131 and 3A-619
Figure 8. TDR concept
Figure 9. Application specific MCU and 100BASE-T1 SPE PHY evaluation module
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