ESD April 2025

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April 2025 Volume 14, Issue 04

Training the next generation of engineers

NEWS

MEDICAL

ECO INNOVATION

Driving sustainability through collaboration WOMEN IN TECH

Push towards nuclear waste battery

Tech trends reshaping healthcare

Harnessing tech to drive climate change

CONTENTS.

Comment/ embedded world 2025

News/ Scientists push towards nuclear waste battery STEM Spotlight/ The intersection of technology and education Women in Tech/ Driving sustainability through collaboration Power: SiC/ Evaluating SiC efficiency and payback

T&M: Tips/ Practical tips for measuring ultralow bias current Medical: Trends/ Technology trends looking to reshape healthcare Medical: Sensors/ How smart sensors are revolutionising medical technology

Eco Innovation: Energy Harvesting/ Powering smart buildings sustainably

Eco Innovation: IoT/ Harnessing technology to drive climate action

Managing Editor: Paige West paige.west@electronicspecifier.com Associate Sales Director: Ben Price ben.price@electronicspecifier.com Sales Associate: James Anstee james.anstee@electronicspecifier.com

Head Office: Electronic Specifier Ltd Tythe Barn, Carriers Road, Cranbrook, Kent TN17 3JU UK Tel: 01622 871944

Production Manager: Sherilee Holliday sherilee.holliday@electronicspecifier.com CEO: Steve Regnier steve.regnier@electronicspecifier.com

Copyright 2025 Electronic Specifier. Contents of Electronic Specifier, its publication, websites and newsletters are the property of the publisher. The publisher and the sponsors of this magazine are not responsible for the results of any actions or omissions taken on the basis of information in this publication. In particular, no liability can be accepted in result of any claim based on or in relation to material provided for inclusion. Electronic Specifier is a controlled circulation journal.

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EDITOR’S COMMENT

embedded world 2025 A milestone for Edge AI and industry collaboration

e mbedded world 2025 has once again demonstrated why it is the go-to event for the embedded electronics industry. Walking through the exhibition halls, one thing was clear: Edge AI has moved from an emerging trend to a key driver of innovation. The conversations were no longer about whether AI at the Edge is possible, but rather about how best to implement it in real-world applications. This year’s event was a resounding success, with packed conference sessions, a dynamic show floor, and a strong sense of optimism about what’s ahead. Electronic Specifier had the privilege of being at the heart of it all, engaging with industry leaders, engineers, and innovators shaping the next generation of embedded systems. Edge AI at the forefront The theme dominating discussions was Edge AI – its potential, its challenges, and its growing adoption across multiple industries. Advances in low-power AI processing, optimised software frameworks, and ener- gy-efficient neural networks are enabling intelligence at the Edge without reliance on Cloud connectivity. From industrial automation to automotive applications and

wearables, embedded AI is transforming system capabilities, bringing greater efficiency and real-time decision-making to devices operating in the field. A key takeaway from the event was the shift from theoretical discussions to practical deployment. Engineers and product designers are no longer asking if AI can be embedded into their systems, but rather how to do it in the most power efficient, scalable, and secure way. Celebrating excellence in electronics This year also marked another successful edition of our Electronics Excellence Awards, where we had the opportunity to recognise groundbreaking innovations in electronic design. The awards celebrated engineering achievements that push the boundaries of embedded technology, showcasing the ingenuity and expertise of engineers shaping the future of the industry. With a strong lineup of finalists and winners across multiple categories, the event highlighted the sheer breadth of innovation happening across the sector. You can

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EDITOR’S COMMENT

find out more about our winners on the Electronic Specifier website. Empowering women in tech Another highlight was our Women in Tech forum, hosted in partnership with #women4ew. The forum brought together leading female engineers, executives, and innovators to discuss the evolving role of women in electronics and engineering. Diversity and inclusion remain key challenges for the industry, and platforms like this are essential in driving change. The discussions focused on mentorship, career development, and the impact of diverse perspectives on innovation. With a growing number of talented women making their mark in embedded design, it was encouraging to see the industry taking active steps to support and promote gender diversity. As we look ahead, it’s clear that the embedded industry is in the midst of a

significant transformation. AI, automation, and energy efficiency will remain top priorities, and Electronic Specifier will continue to bring insights, analysis, and expert perspectives to help engineers navigate this evolving landscape. Until next year, embedded world has once again reinforced the incredible potential of embedded electronics – and we can’t wait to see what’s next!

Paige West, Managing Editor

Build on your proficiency Quick tips, tools and articles for purchasing professionals

mou.sr/purchasing-resources

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WOMEN INNTEEWCSH

Scientists push towards nuclear waste battery Researchers have developed a battery that can convert nuclear energy into electricity via light emission. This comes at a time as nuclear power gains traction to feed the power-hungry data centres of big tech. waste, which can be dangerous to human health and the environment. Safely disposing of this waste can be challenging.

power microelectronics, like microchips.

Using a combination of scintillator crystals, high-density materials that emit light when they absorb radiation, and solar cells, the team, led by researchers from The Ohio State University, demonstrated that ambient gamma radiation could be harvested to produce a strong enough electric output to

Nuclear power plants, which generate about 20% of all electricity produced in the United States, produce almost no greenhouse gas emissions. However, these systems do create radioactive

Affordable brainwave reader

People who can no longer communicate through speech or eye movement can use the power of thought to indicate ‘yes’ or ‘no’ thanks to a brainwave reader developed by Nottingham Trent University (NTU). Professor Amin Al-Habaibeh, an expert in intelligent engineering systems, wanted to support charities which help people with advanced Motor Neurone

Disease (MND) and Completely Locked-in Syndrome after his brother- in-law, Mr Naeem Radwan, passed away aged 38 after having MND. The research has led to the development of a brainwave reader which is made affordable by using off-the-shelf parts and a novel artificial intelligence (AI) algorithm developed by the research team.

Promise for green electronics

Electronic devices rely on materials whose electrical properties change with temperature, making them less stable in extreme conditions. A discovery by McGill University researchers that challenges conventional wisdom in physics suggests that bismuth, a metal, could serve as the foundation for highly stable electronic components.

electrical effect in ultra-thin bismuth that remains unchanged across a wide temperature range, from near absolute zero (-273°C) to room temperature.

The finding could lead to the development of more efficient,

stable, and environmentally friendly electronic components and devices, including for space exploration and medical uses. Bismuth is non-toxic and biocompatible.

The researchers observed a mysterious

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NEWS

Restoring movement in paralysis patients

A recent study by scientists at Neurorestore has demonstrated that combining spinal cord stimulation with robotic rehabilitation can enhance motor function in individuals with paralysis. This research aims to improve traditional rehabilitation robotics, which may not always elicit sufficient neural activity for effective recovery.

The device delivers electrical epidural stimulation to the spinal cord, synchronised with robotic-assisted movements. The stimulation mimics natural neural patterns, enhancing muscle activation during therapy. Importantly, the neuroprosthesis is device-agnostic and designed for seamless implementation by non-expert users, making it adaptable across various rehabilitation settings.

AI aids in brain injury investigations

Researchers from the University of Oxford have unveiled an AI- driven tool designed to assist with investigations into traumatic brain injury (TBI) within forensics and law enforcement. The findings, published in Communications Engineering, introduce an advanced physics- based, machine learning framework that could revolutionise the way TBI

cases are approached in forensic investigations.

powered by mechanistic simulations, can offer data-driven predictions to help forensic experts and police accurately assess TBI outcomes in the context of reported assault incidents.

TBI remains a significant public health concern, with potentially devastating and long-lasting neurological effects. For law enforcement and legal teams, establishing whether an impact caused an injury is essential, but the field has lacked a standardised, quantifiable method for such determinations. This new study demonstrates how AI,

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WOMEN INNTEEWCSH

Biosensor detects bird flu in under 5 minutes As highly pathogenic H5N1 avian

Sensors on ‘breath sensing’, virus trackers have a way to monitor aerosol particles of H5N1. To create their bird flu sensor, researchers in the lab of Rajan Chakrabarty, a professor of energy, environmental, and chemical engineering at WashU’s McKelvey School of Engineering, worked with electrochemical capacitive biosensors to improve the speed and sensitivity of

virus and bacteria detection.

influenza continues to spread in the US, posing serious threats to dairy and poultry farms, both farmers and public health experts need better ways to monitor for infections, in real time, to mitigate and respond to outbreaks. Now, thanks to research from Washington University in St. Louis published in a special issue of ACS

UKRI showcases the technologies of tomorrow

A newly released online brochure highlights how cutting-edge technologies are transforming key industries – from plastics recycling to food production, transport, and communication – through investments made by UK Research and Innovation’s (UKRI) Technology Missions Fund. The fund is driving mission-led research and development to address global

challenges in health, sustainability, and economic growth. The digital collection features case studies and video stories that illustrate the real-world outcomes of UKRI-funded projects. It highlights collaborations between academia, businesses, and multiple partners across the UK, all focused on accelerating technological innovation for the benefit of society.

UK semiconductor industry gets a boost Wales is set to benefit from a £250 million investment from one of the world’s largest manufacturers of semiconductors that will be vital to the production of electric vehicles, supporting the government’s Plan for Change in delivering more skilled jobs, and turbocharging the economy. intention to invest on a visit to their Newport plant – the UK’s largest semiconductor facility – as part of plans to develop large- scale compound semiconductor manufacturing in the country.

advanced technology supports faster battery charging time, enabling a more efficient supply of energy to the motor and longer driving distances.

The investment will boost production at the factory where it will make advanced silicon carbide semiconductors, an integral part of electric vehicle production. This

The Chancellor Rachel Reeves will welcome Vishay Intertechnology’s

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Dukosi Cell Monitoring System (DKCMS) with C-SynQ for next generation high power battery systems The Dukosi Cell Monitoring System (DKCMS) with C-SynQ is revolutionising the performance, safety, and sustainability of high-performance batteries. Dukosi’s contactless cell monitoring solution is extremely robust, scalable, flexible, higher performing, and more reliable than traditional battery architectures.

overtemperature event during operation.

DKCMS with C-SynQ is ideal for a wide range of battery-powered applications such as electric vehicles, battery energy storage systems, marine applications, industrial transportation including ground support equipment operating at airport, and even eVTOL. Dukosi offers development tools to evaluate and accelerate the development of DKCMS-based battery systems. The DK8x02 Evaluation Kit (EVK) is a powerful evaluation and development tool used by battery developers and BMS designers to discover the unique advantages DKCMS. From unboxing to establishing a cell network using Dukosi’s intuitive Windows-based software environment (GUI) can be achieved in as little as 15 minutes. For energy storage developers, a 54-cell reference design is available to streamline the creation of rack modules. Dukosi provides comprehensive support to partners throughout the development of their next-generation battery designs.

D KCMS consists of the DK8102 Cell Monitor chip, DK8202 System Hub chip, and the Dukosi Library API. A Cell Monitor mounted directly onto each cell provides accurate monitoring of key operating parameters such as voltage and temperature, along with necessary cell balancing functionality and diagnostics. The System Hub manages the bidirectional data transfer between all of the cell monitors and the BMS host using Dukosi’s proprietary C-SynQ communication protocol, using near field RF via a single bus antenna. C-SynQ provides highly secure and extremely robust and reliable communication with predictable latency, while synchronising all cell monitor measurements, improving the accuracy of SoX calculations, and thus, battery pack performance. Each DK8102 Cell Monitor has an on-chip die temperature sensor and inputs for two external thermistors. By capturing the temperature of every cell, DKCMS improves the safety and reliability of batteries because other architectures typically only install one sensor every several cells. Monitoring the temperature of every cell in up to three places can precisely detect any

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STEM SPOTLIGHT

The demand for engineers is growing faster than universities can supply them. The industry needs a workforce that can build the next generation of computing, communications, and automation technologies, but the gap between education and real-world engineering challenges is widening. Senior engineers often find mentoring fresh graduates time-consuming, as many lack the hands-on skills needed to contribute immediately. If universities focused on stronger theoretical foundations combined with practical, problem-solving approaches, companies could onboard engineers more efficiently and accelerate innovation. The intersection of technology and education How Red Pitaya collaborates with universities to train the next generation of engineers

E lectrical engineering is becoming less popular among students, despite its critical role in modern technology. To close the skills gap, education must evolve. Universities need to produce graduates with both deep theoretical knowledge and the ability to apply it in real-world scenarios. This shift is already happening, but not fast enough. Red Pitaya works with universities worldwide to bridge this gap. We measure our impact not just by how many students use our technology but by the number of research projects and startups that emerge from these programmes. Students who gain hands-on experience with our tools often go on to work in cutting-edge companies, applying the problem-solving skills they developed in academic settings to real-world engineering challenges. One way to accelerate this shift is through industry-academia collaboration. We support universities in integrating hands-on learning into engineering curricula, providing tools that allow students to build, test, and iterate in real-world conditions. Our partnerships with universities worldwide, including the Technical University of Munich (TUM) and the University of California, San Diego (UCSD) bring students closer

to the industry through hackathons and hands-on problem-solving competitions. At Southern Methodist University (SMU), we collaborate with professors to develop teaching materials that combine theory with hands-on experimentation. Beyond university students, we also work on upskilling initiatives, such as our FPGA course for scientists, equipping professionals with the skills needed to work with modern programmable hardware. Some of the most valuable companies in technology today started as university research projects. Red Pitaya has been part of this journey for several academic spin-offs that have transitioned into successful businesses. A university lab working on ultra-precise time measurements used Red Pitaya to prototype high-precision timing solutions. Their research evolved into commercial products used in quantum optics and high-speed communications. A team developing high-speed, low-latency data acquisition systems used Red Pitaya as a flexible research tool before turning their technology into an industrial-grade solution. Today, their systems are used in demanding scientific and industrial applications.

By Mateja Lampe Rupnik, CEO, Red Pitaya

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STEM SPOTLIGHT

A company specialising in high-precision frequency stabilisation and laser control began as an academic research project. Red Pitaya helped them iterate on designs quickly, shortening the transition from concept to market-ready technology. These examples show the impact of providing engineers with flexible, open platforms early in their careers. Bridging the gap between academia and industry requires more than just better coursework. It demands real-world problem-solving, hands-on experimentation, and industry collaboration. Red Pitaya’s commitment to engineering education was recently recognised at the Learning Awards 2025, where we won gold in the Learning Technologies category. This award celebrates organisations that have implemented innovative learning technologies with demonstrable impact on education and industry. It marks the second

time Red Pitaya has been recognised for its contribution to academia, following our Academic Support Award in 2022. These achievements highlight the importance of hands-on, technology-driven learning and reinforce our ongoing efforts to equip the next generation of engineers with the skills they need to drive innovation.

Discover Arrow’s solutions covering AI, cyber resilience and many more at booth J1

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marketplace – can help you turn your unused components, peripherals, and IT equipment into a source of revenue. This secure part-exchange platform efficiently and effectively matches your surplus with verified buyers, allowing you to easily negotiate a mutually beneficial agreement. Additionally, our lot-buy and consignment programmes can help you move your surplus inventory quickly and free up warehouse space. Depending on your needs, consigned inventory can be stored across Smith’s ESD-safe warehouses in Amsterdam, Houston, Hong Kong, and Singapore. Once consigned, Smith will market, resell, and ship your product directly from stock. Market shifts are unpredictable and can have devastating impacts on your supply chain, but Smith can help you stay ahead of the curve and mitigate any potential disruptions. Follow us on social media and visit smithweb.com to discover how Smith can help you navigate market complexities with confidence and agility.

W e have more than 40 years of experience in the industry and decades of market data to help us bridge gaps across the semiconductor supply chain. With sales offices and operational hubs in more than 20 cities across four continents, Smith offers localised support on a global scale. Our highly trained procurement and sales teams provide tailored supply chain solutions to customers worldwide and have cultivated deep expertise in navigating today’s volatile market complexities. Smith excels in this dynamic landscape, identifying and responding to supply chain challenges in real time. We offer our customers unparalleled support backed by sophisticated market intelligence and sourcing capabilities across franchised, direct, and open-market channels. As a leading independent distributor of semiconductors and provider of supply chain services, we not only understand the market but also help shape it. We work with you to identify pain points in your inventory-management processes and can build a programme to support your success. Our nimbleness, adaptability, and fully customisable solutions make us an ideal partner for projects of any size or scope. Among our comprehensive suite of supply chain solutions, SmithTrade™ – our exclusive online

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DESIGN WOMEN IN TECH Driving sustainability through

collaboration

Sustainability is often framed as a technical challenge – one that requires innovation, regulatory compliance, and corporate investment. But for Leila Bardasuc, Co-Founder of The Sustainability World Cup (SWC), sustainability is just as much about people as it is about technology. Through her work, Bardasuc has championed a more holistic approach, one that embraces collaboration, empathy, and what she calls "the strategy of kindness."

B ardasuc’s journey is one that is driven by a desire to connect people and technology in ways that create impact. As a Professor and researcher within STEAM School on topics such as Transformation of Business Models, Marketing and Communication at Universidad Europea in Madrid, she has dedicated her career to bridging academia and industry, mentoring entrepreneurs, and advising companies on digital transformation. “What really inspires me is the potential for collaboration to solve complex challenges,” she said. This mindset led her to co-found The SWC with Edmund Bradford, a UK-based educator and entrepreneur. The SWC is a global programme and competition designed to help businesses and individuals integrate sustainability into their strategic decision-making.

The strategy of kindness: a competitive advantage At the heart of Bardasuc’s approach is the strategy of kindness – a concept built on three pillars: competitive advantage, collaborative leadership, and creating networks. “I’ve seen how trust and empathy transform outcomes,” she explained. “Kindness isn’t just a personal value; it’s a strategic advantage.” Her experience working across industries, particularly in simulated environments, reinforced the idea that compassion and shared goals lead to better results. She observed how rigid silos and short-term business strategies often overlooked the human element, creating barriers to meaningful progress. By integrating kindness as a guiding principle, she

By Sheryl Miles, Associate Editor

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WOMEN IN TECH

has built trust-based relationships and impactful ecosystems. “We start with competitive advantage and then see how we can integrate kindness within that,” she said. A new way to engage with sustainability The Sustainability World Cup brings these ideas to life by providing an interactive, gamified platform where participants – ranging from students to corporate teams – compete using the Sustain2Win simulation. They direct virtual companies, making strategic decisions that balance profitability with sustainable outcomes. “It’s more than a training programme; it’s the first step in creating a community of change-makers,” Bardasuc explained. By encouraging collaboration across industries and disciplines, the competition encourages participants to learn from each other while working towards a common

goal. “We are competing, but it’s a good competition,” she said. “The strategy of kindness ensures that this ecosystem thrives on empathy and shared purpose.” Real-world impact and long-term change Despite its relatively recent launch in 2024, The Sustainability World Cup has already made a tangible impact. Participants have applied their learning to real-world sustainability projects, formed partnerships across sectors, and even advanced their careers. “We’ve seen participants admitted to master’s and research programmes, invited to international events as speakers and change-makers,” Bardasuc said. “The ultimate goal is to create a cultural shift where sustainability becomes a natural part of decision-making and leadership.” The competition is structured to mirror the way professionals develop expertise – similar to how racing drivers use simulation

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takes many forms.”

Looking ahead With 2025 shaping up to be its most

impactful year yet, the Sustainability World Cup is expanding its reach. “We’ve built new partnerships in motorsports, Industry 4.0, AI, and sustainability,” Bardasuc shared. “We’re using networking software, introducing even more innovative training, and creating a larger stage for sustainable innovation.” The competition pre-launch forum took place in March, and the event kicks off in April 2025, offering a global platform for individuals and organisations to engage with sustainability in a dynamic, competitive, and constructive way. The award ceremony will take place in June and there will be a celebration at the Digital Enterprise Show in Malaga, recognising the achievements of participants who have turned sustainability from a theoretical concept into a real-world strategy. Bardasuc’s message to readers is simple: sustainability is for everyone. “We’d love to hear from people about how they are implementing sustainability in their work, how they see the future of sustainability and digital transformation working together,” she said. “We’ve learned so much from different sectors, industries, and academic institutions, and we want to continue building on that.” For those looking to make their mark in traditionally male-dominated industries, Bardasuc offers some clear advice: “Lead with confidence, stay curious, build relationships based on trust and collaboration, and remember that success isn’t just about individual achievements. It’s about lifting others too.” The Sustainability World Cup may be a competition, but its true success lies in the connections it creates, the leaders it empowers, and the lasting change it inspires.

training to hone their skills. “You learn, analyse data, adapt to rapid changes, and when you’re ready, you go out and make an impact,” she said. Women in sustainability and leadership As a woman leading an initiative in sustainability and innovation, Bardasuc has approached challenges by focusing on expertise, collaboration, and delivering results. “I haven’t really seen them as challenges, per se,” she reflected. “Staying true to my values and fostering trust has helped turn challenges into opportunities.” She is also committed to encouraging more women to enter the fields of sustainability and STEM. Through The Sustainability World Cup, the Sustaining Success podcast, and her academic work, she is consistently looking for ways to amplify voices and create platforms where diverse perspectives are celebrated. “We’re not just creating opportunities; we’re inspiring the next generation of change-makers,” she said. The competition’s intentional focus on inclusivity has resulted in a diverse network of participants, mentors, and judges, demonstrating that sustainability leadership is open to all. “We set out to discover the best sustainability leaders of tomorrow, and our participants are showing that leadership

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Evaluating SiC efficiency and payback in warm and cold climates Silicon carbide (SiC) is transforming the efficiency and performance of heat pump and air conditioning systems in both hot and cold climates, increasing overall system efficiency while reducing energy consumption and lifetime system costs. I n this article, we explore how two Figure 1. Seasonal inverter efficiency in systems with SiC vs Si-IGBT

European cities with differing climates can benefit from designing heating and cooling systems with silicon carbide power devices instead of traditional Si-IGBTs (insulated gate bipolar transistors). First let’s explore how some common residential heat pump systems (10-15kW three-phase inverter) perform in Istanbul’s warm climate versus Oslo’s cold climate. Figure 1 illustrates seasonal inverter efficiency in systems with silicon carbide vs Si IGBT and reveal efficiency improvements from 2% in the cold climate of Oslo to upwards of 4% in Istanbul. At first glance, the efficiency improvements may seem counterintuitive. The graphs presented indicate that while the efficiency gain with SiC in colder climates is lower than in warmer climates, the overall actual energy savings are greater in colder regions.

By Pranjal Srivastva & Sarah Magargee, Wolfspeed

This phenomenon can be attributed to the load dynamics of heat pumps. In warmer climates like Istanbul, the heat pump operates at lower loads, meaning that while the efficiency improvement is significant – around 4% – the overall energy demand is lower (Figure 2). Consequently, the total energy savings achieved with SiC inverters are not as pronounced. In colder climates, the load on heat pumps is considerably higher. Although the efficiency improvement of SiC over IGBT is about 2% – lower than the 4% seen in warmer climates – the higher energy demand in colder regions results in substantial overall energy savings. This underscores the importance of considering both efficiency and load when evaluating the performance of heat pump systems. The high/low load differential and impact on efficiency and energy savings can be seen in a similarly high-power system optimised

Figure 2. Load dynamics impact annual savings

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for cost and size.

Figure 3 illustrates a 25kW air compressor inverter switching at 8kHz and the efficiency improvements seen with a 30A SiC 1200 V 6-pack power module. This power module is smaller in current rating and physical dimensions then the 1200V IGBT modules it is compared to (50 and 100A rated). The graph on the right shows the 30A rated SiC and the 50A rated Si IGBT reaching similar junction temperatures at peak loads, despite lower current rated SiC MOSFET with a 77% smaller heat sink. Efficiency improvement would be greater if similar sized heat-sinks were used in systems not optimised for size or cost. The inverter efficiency improvement with SiC MOSFETs at partial loads is higher than at peak loads due to linear transfer characteristics of SiC vs. non-linear characteristics of Si IGBT with a knee voltage, leading to significantly higher conduction losses at partial loads (Figure 4). SiC also has lower switching losses than IGBT, making them ideal to reduce heat pump audible noise in fast switching air compressor inverters. Figure 5 demonstrates how Si IGBTs reach thermal overdrive at partial loads in the same 25kW inverter switched at 16kHz instead of 8kHz, while the SiC based inverter exhibited

higher thermal stability and efficiency improvement with a 40% smaller heat sink. This could result in a quieter, more optimised and efficient heat pump. Energy efficiency and system lifetime payback in warm vs cool climates The correlation between climate and efficiency/energy savings is also seen in system lifetime payback calculations. A thermally stable residential SiC powered 25kW inverter switching at 16kHz with a mix of peak and partial load conditions in our cold Norway climate could realise an estimated ¢4,586 savings over the systems’ lifetime when compared to a Si IGBT powered inverter switching at 8kHz. Additional savings could also be realised if the SiC powered inverter were switching at higher frequencies. This is clearly highlighted (Figure 6) in the variable cost difference analysis of the two systems and including the active front end,

Figure 3. Illustrating the efficiency improvements with SiC at partial and peak loads despite a smaller heat-sink, in a 25KW peak load 3-phase air compressor inverter switching at 8kHz

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Figure 4. Under lower loads the SiC MOSFET conduction losses can be nearly half that of Si-IGBT

Figure 6. Variable cost analysis in a 25kW Air Compressor System

which connects directly to the grid supply. Despite the SiC module being about a twice as expensive as the higher current rated Si IGBT modules, the overall BOM cost is expected to be only about 15% higher which would be paid back in quick time due to higher energy savings, particularly at partial loads. Conclusion The takeaway from these findings is that while SiC inverters demonstrate greater efficiency improvements in warmer climates, the real benefits in terms of energy savings are realised in colder climates. This is due to the higher operational demands placed on heat pumps in these regions, leading to faster

payback periods for systems utilising SiC technology. Focusing on specific cities like Istanbul and Oslo reveals a compelling narrative. While Istanbul shows a higher efficiency improvement with SiC, the overall energy savings in Oslo are greater due to the higher energy demand. This highlights the critical role that load conditions play in determining the effectiveness of different inverter technologies. In summary, the analysis underscores the importance of designing heat pump systems with SiC technology to maximise energy savings, operational efficiency and payback, regardless of climate.

Figure 5. Illustrating the efficiency improvements with SiC at partial and peak loads despite a smaller heat-sink, in a 25kW peak load 3-phase air compressor inverter switching at 16kHz

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Practical Tips for Measuring Ultralow Bias Current Using Commercial-Grade Lab Equipment

Question: Is there an easy way to measure ultralow bias currents in the femtoampere area? Answer: Yes – it just requires a careful setup.

In applications where low leakage current is required, it is important to select a low input bias current (I B ) operational amplifier. The application note, AN-1373 describes how to measure ultralow bias current using the ADA4530-1 evaluation board. However, due to the nature of handling femtoampere (fA) level currents, the measurement environment – equipment such as jigs, shield, cable, and connectors – also affect the measurement results.

By Aoi Ueda, Field Applications Engineer, Analog Devices

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T&M: TIPS T his article will introduce a trial to jigs, and materials commonly available, and also includes some workarounds to improve the measurement to finally achieve 50fA. First, we measure the input capacitance for bias current measurement and the variation of output voltage with charging of the input capacitance under the condition of 125°C. We also attempt to derive the bias current value from the recreate the measurement in AN-1373 using commercial-grade lab equipment, measured output voltage. Finally, we will try to improve the measurement environment based on the measurement results. Capacitive integration measurement According to AN-1373, the input capacitance (C p ) of the ADA4530-1 must be measured first in order to use the capacitance integral measurement method. We will perform this experiment using the ADA4530-1R- EBZ-BUF with the ADA4530-1 configured in buffer mode. Next, we calculate the input current (I B+ ). Specifically, using the circuit configuration shown in Figure 1, when the SW in the test box is turned from ON (grounded to GND) to OFF (open), I B+ flows into the C p . The output voltage rises as I B+ charges C p , so the value of I B+ can be calculated by monitoring

Figure 1. A diagram of the capacitive integration measurement method.

Figure 2. Calculation of Cp using series resistance of input.

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temperature in the temperature-controlled chamber rises to 125°C in the experiment described in the section 'Measuring I B+ with Known Input Capacitance' (page six of AN-1373), we use materials that can withstand such a temperature. RG-316U was used as the material for the coaxial cable. Furthermore, the non-inverting inputs of the ADA4530-1 on the evaluation board are triaxial connectors. For this reason, a triax-to-coaxial conversion connector (BJ-TXP-1 from the Axis Company) was used. In this configuration, the guard terminal on the triax side was left floating. As a result of the measurement, C p = 73.6pF was obtained, which is a relatively large value since the actual measurement, according to AN-1373, is about 2pF. The reason for this is related to the cable length from the test box – which looks more like a test board – to the non-inverting input. Measuring I B+ with known input capacitance Finally, we start to measure the bias current. The circuit configuration is shown in Figure 1, and the mounted test box is shown in Figure 4. Note that the input resistor used in the section 'Measuring Total Input Capacitive with an Input Series Resistor' is removed. As described in AN-1373 (the capacitive integration measurement method, page seven), short circuit the SW to GND, then open it and monitor the output voltage fluctuation with a digital multimeter (DMM) for a few minutes (We used the 34401A DMM from Keysight Technologies). Finally, calculate the I B+ by substituting V OUT into Equation 1. The results of three measurements under the same conditions are shown in Figure 5. The lower part of the figure shows the output voltage fluctuation of the ADA4530-1 measured by the DMM, and the upper part shows the current value calculated using Equation 1. The figure shows that for all three instances, there is no repeatability in the measured voltage values. Therefore, the waveform of the calculated current value

and substituting it into Equation 1.

Figure 3. C p measurement setup: (a) inside the temperature-controlled chamber - the evaluation board of ADA4530-1 is shown - and (b) setup of the test box side.

Measuring total input capacitance with an input series resistor To calculate C p , this experiment adopts a method using series resistance. Figure 2 shows a simple circuit diagram. The value of the series resistance is based on the measurement guidelines found on page 6 of AN-1373, and the actual value is R s = 8.68M Ω . An SW is also mounted in the test box for later experiments (SW is open at this time). The frequency at which the waveform from the function generator is attenuated to –3dB can be measured, and the input capacitance can be calculated using Equation 2.

Figure 3 shows the setup. Since the

Figure 4. Setup of the capacitive integration measurement.

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also has a different shape from the result described in AN-1373 (see AN-1373 figures 13 and 14). How to improve the measurement environment In the section 'Capacitive Integration Measurement', we measured I B+ based on the AN-1373, but the results differed. In this section, we share the steps to improve the measurement environment and thus, the accuracy of the measurements. Mount a shield box and shorten the input cable First, we have made the following two improvements: Figure 5. Measurement results. The lower side shows the output voltage of ADA4530-1 measured by the DMM, and the upper side shows the current value calculated using Equation 1. The blue line is the first measurement, the green line is the second measurement, and the red line is the third measurement.

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Figure 7. Shortening the coaxial cable.

The output voltage measured by the DMM increased with a constant slope and reached around 4.16V in all measurements. The corresponding current shows a value of about 50fA. Furthermore, the red line in Figure 9 shows the waveform of the remeasurement with a shorter coaxial cable connected to the noninverting input terminal (C p = 26.5pF). The slope of the voltage rise is as large as the theoretical calculation. From these measurement results, it was found that the conductance component on the input side has a significant adverse effect on the measurement accuracy. Conclusion Although the fA level measurement can be performed in a general lab environment, the path of the leakage current on the input side of the operational amplifier needs to be carefully considered. In order to improve the accuracy of the measurement, it is recommended to use a Teflon terminal block on the input side or a triaxial cable together with the evaluation board. Acknowledgements The author would like to thank Scott Hunt, Iku Nagai, and Jun Kakinuma for their technical advice. Figure 9. Measurement results after removing the test box. The blue, orange, and green lines are measurement results at Cp = 35.2pF. The red line is the measurement result when C p = 26.5pF.

• A shield box was installed on the evaluation board inside the

thermostatic chamber (see Figure 6)

• The coaxial cable connected to the non-inverting input terminal was shortened to reduce the C p (see Figure 7) For one, we expect to reduce the effect of external noise, and for two, we expect to reduce the small leakage current in the cable (the re-calculated C p is 35.2pF). However, although these measures were taken and remeasured, no reproducibility was observed, similar to the results obtained in 'Capacitive Integration Measurement'. The waveforms differed significantly from the expected ones. Remove the test box The test box used was removed and the SW was changed by directly shorting and opening the ground (see Figure 8). In other words, the conductance component called the test box was removed and the measurement was performed. As a result, we were able to obtain the waveform as shown in Figure 9.

Figure 8. Measurement with test box removed. Short and open operation by hand instead of the SW.

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