DESIGN
A&D: DESIGN
W e at TI have historically after verification in a plastic package did the engineering team start on the ceramic design. But ceramic packages are usually not drop-in compatible with plastic packages, which necessitates developing new test and characterisation hardware and qualifying the ceramic package test solution for large-scale production. These efforts pose a problem for space hardware designers because they either have to wait for the creation of the ceram- ic-packaged device to start their prototype build or start with the plastic-packaged IC for their prototype and redesign and refabricate the board when ceramic samples become available. developed devices for commercial (non-space) use first; only
What is SHP? TI has developed a new device screening specification called space high grade in plastic (SHP) for space-qualified devices constructed in plastic packaging traditionally used in industrial applications. SHP includes both plastic substrate ball-grid array (BGA) and plastic-encapsu- lated packages. The SHP qualification level produces devices suitable for tough mission profiles typically served with ceramic Qualified Manufacturers List (QML) Class V devices. The SHP level represents a reliability grade higher than TI’s space-enhanced products in many parameters important to tough
Table 1. Comparing TI’s SHP qualification category to other known or drafted standards
31 ELECTRONICSPECIFIER.COM
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