DESIGN
A&D: DESIGN
coupling between adjacent signal lines for plastic packages is over 2.5 times less, improving crosstalk and signal integrity • The lower permittivity enables the creation of 100- Ω differential lines and 50- Ω single-ended lines with smaller wire-to-wire spacings and smaller wire-to-ground spacings, enabling higher density-controlled impedance lines in plastic substrates compared to ceramic substrates • The lower capacitance plastic substrates improve the bandwidth and return loss of key analog signals Additionally, plastic substrates yield a higher bandwidth through the use of copper for signal lines and power planes, versus the tungsten used in ceramic substrates. Copper has over a third less electrical resistance compared to tungsten. Conclusion TI’s SHP space-qualification level provides
higher thermal efficiency, a smaller footprint and increased bandwidth compared to traditional ceramic packaging. The common package and pinout between the industrial- and space-grade versions enable you to get the newest technologies into your space hardware designs as soon as the commercial-grade device is sampling, because all prototyping work on the commercial product translates directly to a drop-in space-qualified SHP product when it’s time to fly the system. Additional resources • Learn about our other radiation-hard- ened and radiation-tolerant products at TI.com/space. • Keep up to date with newly released space products with the ‘TI Space Products Guide.’
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