DESIGN
The need for speed Consumer demand is driving the need for ever-faster silicon chips, also known as integrated circuits (ICs) or semiconductors. In tandem with the trend for increasingly compact electronic devices, there is a distinctly unwanted side effect: heat. The faster an IC runs, particularly in a small space, the hotter it gets. Electronics need to operate within a specified temperature range to achieve optimal operation, so the need to remove heat from an IC and disperse it effectively and safely is very real. The answer? Adopting the latest generation of appropriately specified and applied thermal interface materials. A ny OEM or CEM electronics companies operating in sectors such as telecommunications, formance products is the only way to meet the thermal and design challenges of tomorrow’s systems. Drivers of new thermal interface materials (TIMs) include lower thermal impedance, higher thermal By Tim Kearvell, Elastomer Product Manager, Parker Chomerics
information technology, power conversion, medical device, defence, or transportation will know all about the thermal challenges associated with faster ICs. It seems every new generation of an electronic product requires higher power in a smaller package, exacerbating the need for optimal thermal management. The good news for these companies is the relentless innovation drive at thermal management solutions suppliers such as Parker Chomerics. Developing high-per-
conductivity, better conformability, increased reliability, greater adhesion and longer service life, as well as easier handling, application, and use. Chip cooling Applying a TIM to an IC surface requires intimate contact between two surfaces. Even though the surface electronic components and heatsinks may appear flat
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