DESIGN
paramount importance, particularly in safety-critical electronics applications such as those prevalent in sectors such as aerospace, defence, power generation, auto- motive/e-mobility, and healthcare. Board-level shielding and stamped metal components are the optimal solution for reducing or limiting the effects of EMI. Solutions of this type help isolate board-level components, minimise crosstalk, and reduce susceptibility to EMI by forming an electrically conductive ‘box’ or faraday cage around the components. Component design options include one-piece, two-piece, and multi-cavity configurations, while also incorporating precise mounting methods such as surface mount technology (SMT). The manufacture of EMI shielding components is typically via a stamping/forming or drawing process based on specific design criteria and end-user requirements. Board level shields can also integrate unique design features including, but not limited to, ventilation holes, complex geometries, embossing, and orientation markings. Parker Chomerics offers board-level shielding products in several base materials and plating options, including tin-plated cold-rolled steel, nickel-silver, aluminium and stainless steel, with other materials and
plating options available on request. Component integration As each application is unique, board-level shields must not only offer excellent high-frequency EMI shielding, but also high customisation potential and suitability for seamless integration into full PCB builds. By working with a reputable supplier such as Parker Chomerics it is possible to simplify assembly and reduce supply chain and logistics concerns. Examples of integration include thermal interface products, RF-absorbing coatings, electrical grounding materials, and heatsinks. A critical step in the design process is identifying a suitable technology partner experienced in both EMI and thermal interface material development: one that can deliver expert application and engineering support, EMI emissions testing, and the fast and cost-effective prototyping of board-level shielding components. Thermal management and EMI interference are long-standing pain points for electronics engineers. However, with the right specification and application, the latest advances in TIMs and board-level shields mean both OEMs and end users can have confidence in optimally performing electronic components.
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